4/3/2023 0 Comments Solder preform![]() ![]() To help use the glass solder preforms, OZ Optics can supply a basic resistive or inductive soldering station to solder preforms onto metal ferrules and fibers. GSP series glass solder preforms are compatible with single mode (SM), multi mode (MM) or polarization maintaining (PM) fibers in single fiber and ribbon constructions. ![]() Custom configurations can be designed for specific applications, please contact AMS Technologies to select a design to fit your needs. This enables hermetic sealing of optical fibers to metal packages without costly metallization, thus reducing the cost and lead time of the whole packaging process.Īfter processing, assemblies sealed with glass solder can easily meet the stringent humidity resistance, hermeticity, and strength demanded for component packaging. The use of Solder Fortification Preforms will add more solder volume and help obtain the correct amount of solder therefore ensuring a much strong solder. The glass solder preforms bond directly to glass and metal surfaces. OZ Optics’ GSP series of glass solder preforms is designed specifically for hermetic sealing of optical fibers in optoelectronic and all optical packaging. ![]() ![]() solder_fortification_preforms_98552_a4_r7.Circular and Oval Configurations Inner Ø 279 to 4,400 µm Outer Ø 762 to 5,400 µm Thickness 203 to 760 µm Sealing Temperature +340 to +440 ☌.Improved shape and volume of fillet to ensure joints meet IPC specifications Reduced rework and other manual processes to add solder volume Conro Electronics is an authorized distributor for Indium. ConRo Electronics offers a wide choice of solder preforms from major manufacturers such as Indium. Each preform type will be best suited to specific applications. Stronger solder joints, which help improve drop test results Preforms are used across a wide range of industries. Increased solder volume compared to what could be achieved with just solder pasteĮlimination of costly or time-consuming processes, such as wave soldering or selective soldering The preform increases the volume of solder above what could be achieved with just solder paste, especially for stencils with a pitch of 0.3mm or less. AIM is a leader in the production of solder preforms for the global electronic, semiconductor, photonic & automotive industries. Since the alloy for both the preform and the solder paste are the same, the preform will reflow at the same temperature as the solder paste, with the solder paste providing the necessary flux. The preform is added to a deposit of solder paste using standard pick and place equipment. The size of a Solder Preform is determined by the volume of solder needed. Microstamped pieces of foil take the shape that matches solder joints, which optimizes soldering distribution in a precise manner. Solder Fortification® Preforms are generally rectangle- or disc-shaped pieces of alloyed metal that do not contain any flux. COINING’s Solder Preforms are made of solder alloys and customized into shapes and dimensions specific to an application. Solder Fortification® Preforms can provide the solution for these challenging issues. However, miniaturization trends, such as the reduction of stencil thickness and more tightly fitted components, make this increasingly difficult. Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing. ![]()
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